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Now downloading free:Intel ch 07  [report bad file]  

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File name:ch_07.pdf
[preview ch 07] new window
Size:100 kB
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MD5 Checksum:eaaa158191bd5a18d1cdd987fcc1def7
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Intel

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ch 07

Original Chassis:ch 07
Descr: Intel Legacy Package_databook_1999 ch_07.pdf
Group:Electronics > Other >
Uploaded:2019-11-11 18:42:23
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ch_07.pdfLeaded Surface Mount Technology (SMT) 7 7.1 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies with higher I/O, increased board density, and reduced weight, volume, and cost. The weight of printed board assemblies (PBAs) using SMT is reduced because surface mount components (SMCs) can weigh up to 10 times less than their conventional counterparts and occupy about one-half to one-third the space on the printed board (PB) surface. SMT also provides improved shock and vibration resistance due to the lower mass of components. The smaller lead lengths of surface mount components reduce parasit


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