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Now downloading free:Intel ch 07


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File information:
File name:ch_07.pdf
[preview ch 07]
Size:100 kB
Extension:pdf
MD5:eaaa158191bd5a18d1cdd987fcc1def7
Mfg:Intel
Model:ch 07 🔎
Original:ch 07 🔎
Descr: Intel Legacy Package_databook_1999 ch_07.pdf
Group:Electronics > Other >
Uploaded:11-11-2019
User:Anonymous
Multipart:No multipart

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ch_07.pdfLeaded Surface Mount Technology (SMT) 7 7.1 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies with higher I/O, increased board density, and reduced weight, volume, and cost. The weight of printed board assemblies (PBAs) using SMT is reduced because surface mount components (SMCs) can weigh up to 10 times less than their conventional counterparts and occupy about one-half to one-third the space on the printed board (PB) surface. SMT also provides improved shock and vibration resistance due to the lower mass of components. The smaller lead lengths of surface mount components reduce parasit

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