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32587A sc3200 d3 d33 diff

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Descr: AMD 32587A_sc3200_d3_d33_diff.pdf
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32587A_sc3200_d3_d33_diff.pdfAMD GeodeTM SC3200 Processor Silicon Revision D3 to D3.3 Differences 1.0 Scope The purpose of this document is to describe the differences 2.1.2 Pb-Free Package Improvement between silicon revision D3 and D3.3 of the AMD GeodeTM The Pb-free package requires a higher soldering tempera- SC3200 processor. Hence, providing the system designer ture. A small change was made on the top metal layer to with the necessary information to migrate from revision D3 reduce the increased stress on the die due to the increased to D3.3. Each difference notes if there are any hardware or soldering temperature. This change is not a functional software implications specifically related to upgrading a change. revision D3 designed motherboard to revision D3.3 silicon.

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