| 32587A_sc3200_d3_d33_diff.pdf | | AMD GeodeTM SC3200 Processor
Silicon Revision D3 to D3.3
Differences
1.0 Scope
The purpose of this document is to describe the differences 2.1.2 Pb-Free Package Improvement
between silicon revision D3 and D3.3 of the AMD GeodeTM The Pb-free package requires a higher soldering tempera-
SC3200 processor. Hence, providing the system designer ture. A small change was made on the top metal layer to
with the necessary information to migrate from revision D3 reduce the increased stress on the die due to the increased
to D3.3. Each difference notes if there are any hardware or soldering temperature. This change is not a functional
software implications specifically related to upgrading a change.
revision D3 designed motherboard to revision D3.3 silicon.
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