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| File name: | HP-Bench-Briefs-1988-01-03.pdf [preview HP-Bench-Briefs-1988-01-03] |
| Size: | 4377 kB |
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| MD5: | 8b184eeab96956e0dbfa73cb133bb110 |
| Mfg: | HP |
| Model: | HP-Bench-Briefs-1988-01-03 🔎 |
| Original: | HP-Bench-Briefs-1988-01-03 🔎 |
| Descr: | HP Publikacje HP-Bench-Briefs-1988-01-03.pdf |
| Group: | Electronics > Other > |
| Uploaded: | 25-11-2019 |
| User: | Anonymous |
| Multipart: | No multipart |
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| Decompress result: | OK | |
| Extracted files: | 1 | |
| File name | Text | |
| HP-Bench-Briefs-1988-01-03.pdf | SERVICE INFORMATION FROM HEWLETT-PACKARD 1st Quarter 1988 Using Copper Tape to Fabricate RF Breadboard Circuits John Kristiansen Circuit Layout pattern; however, the preferred scale Hewlett-Packard for paper layout is 2:l. If it's not already done, the first Introduction step is to mark your schematic with The 2:l scale is easy to accomplish component reference designators, using 0.200 grid graph paper (some- Do you use insulated wire when connector pin numbers, test point times called "engineering notebook breadboarding your circuit boards? designations, etc., to | |
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