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Now downloading free:HP HP-Bench-Briefs-1975-03-04

Download HP HP-Bench-Briefs-1975-03-04 docs - Various electronics service manuals

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File name:HP-Bench-Briefs-1975-03-04.pdf
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HP-Bench-Briefs-1975-03-04.pdfSERVICE INFORMATION FROM HEWLETT-PACKARD MARCH-APRIL 1975 HOW TO REMOVE ICs side and using a vacuum device on the other. See Figure 4. Shown here by Dick Gasperini, Editor is a smaller vacuum device called Soldavac. Each pin of the IC is un- soldered in this manner, taking care Removing integrated circuits from not to overheat the board. Too much printed circuit boards is a problem heat will cause spots on the

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