datasheet,schematic,electronic components, service manual,repairs,tv,monitor,service menu,pcb design
Schematics 4 Free
Service manuals, schematics, documentation, programs, electronics, hobby ....


registersend pass
Bulgarian - schematics repairs service manuals SearchBrowseUploadWanted

Now downloading free:Intel ch 11

Intel ch 11 free download

Various electronics service manuals

File information:
File name:ch_11.pdf
[preview ch 11]
Size:37 kB
Extension:pdf
Mfg:Intel
Model:ch 11 🔎
Original:ch 11 🔎
Descr: Intel Legacy Package_databook_1999 ch_11.pdf
Group:Electronics > Other
Uploaded:13-01-2020
User:Anonymous
Multipart:No multipart

Information about the files in archive:
Decompress result:OK
Extracted files:1
File name ch_11.pdf

International Packaging Specifications 11 11.1 Electronic Industries Association of Japan (EIAJ) EIAJ publishes the following rules and standards as they apply to the preparation of outline drawings of integrated circuits. Number Nomenclature ED -7300 Recommended practice on standard for the preparation of outline drawings of semiconductor packages ED -7301 Manual or the standard of integrated circuits package ED -7302 Manual for integrated circuits package design guideline ED -7303 Name and code for integrated circuits package ED -7304 Measuring method for package dimensions of ball grid array (BGA) ED -7304-1 Measuring method for package dimensions of Small Outline Package (SOP) ED -7304-2 Measuring method for package dimensions of Small Outline J-leaded package (SOJ) ED -7305 Unit design guide for the preparation of package outline drawing of integrated circuits (gullwing-lead) ED -7311 Standards of integrated circuits package ED -7311-1 Standard of integrated circuits package [TSOP(1)] ED -7311-2 Standard of integrated circuits package [TSOP(2)] ED -7311-3 Standard of integrated circuits package [Tape Ball Grid Array 1.0mm pitch (T-BGA)] ED -7311-4 Standard of integrated circuits package [Tape Ball Grid Array 1.27mm pitch (T-BGA)] ED -7311-5 Standard of integrated circuits package [32/48 pins Fine-pitch Ball Grid Array (FBGA)] ED -7311-6 Standard of integrated circuits package [60/90 pins Fine-pitch Ball Grid Array (FBGA)] ED -7311-7 Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array (P-FBGA)] ED -7311-8 Standard of integrated circuits package [Plastic Fine pitch Ball Grid Array 0.8mm pitch (P- FBGA)] ED -7311-9A Standard of integrated circuits package [P-BGA (Cavity up type)] ED -7311-10A Standard of integrated circuits package [P-BGA (Cavity down type)] ED -7311-11A Standard of integrated circuits package (119/153 pins P-BGA) ED -7311-12 Standard of integrated circuits package (52 pins 64 pins 80 pins and 100 pins low-profile quad flat package with exposed heatsink) ED -7400 Standards for the dimensions of semiconductor devices (integrated circuits) ED -7400-1 Standards for the

>> View document online <<



>> Download document << eServiceInfo Context Help



Was this file useful ? Share Your thoughts with the other users.

User ratings and reviews for this file:

DateUserRatingComment

Average rating for this file: 0.00 ( from 0 votes)


Similar Service Manuals :
Intel 9803092-01 iSBC 86 12 12A Differences Jun79 - Intel 162607-001 iPDS Pocket Reference Apr82 - Intel iPSC System Product Summary - Intel 9803190B iSBX 351 Serial Multimodule Board Hardware Reference Manual Oct80 - Intel 144813-001 System 86 300 Series Diagnostic Maintenance Manual Jun82 - Intel 9800611A iSBC 80 30 Hardware Reference Jun78 - Intel 121636-003 PLM86 Oct82 -
 FB -  Links -  Info / Contacts -  Forum -   Last SM download : Microlab M-333

script execution: 0.02 s