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File name:ch_01.pdf
[preview ch 01]
Size:270 kB
Extension:pdf
MD5:3c03819442949db073a8e7a9241f0df6
Mfg:Intel
Model:ch 01 🔎
Original:ch 01 🔎
Descr: Intel Legacy Package_databook_1999 ch_01.pdf
Group:Electronics > Other >
Uploaded:21-02-2020
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ch_01.pdfIntroduction 1 1.1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Transistor count in products is expected to exceed 100 million. With a greater number of functions integrated on a die or chip of silicon, manufacturers and users face new and increasingly challenging electrical interconnect issues. To tap the power of the die efficiently, each level of electrical interconnect from the die to the functional hardware or equipment must also keep pace with these revolutionary devices. Package design has a major impact on device performance and functionality. Today, submicron feature size at the die level is driving package feature size down to th

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