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Now downloading free:Intel ch 13

Download Intel ch 13 docs - Various electronics service manuals

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File name:ch_13.pdf
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ch 13

Original Chassis:ch 13
Descr: Intel Legacy Package_databook_1999 ch_13.pdf
Group:Electronics > Other >
Uploaded:2020-03-10 13:42:38
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ch_13.pdfPinned Packaging 13 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and thermal characteristics become attributes of component performance along with the mechanical protection offered by the package. To meet these requirements, Intel has introduced a variety of innovative package designs. The development of the plastic pin grid array (PPGA) package, PPGA2, and Flip Chip Pin Grid Array (FC-PGA) have provided an improvement path for enhanced power distribution and improved thermal and electrical performance. While

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