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Now downloading free:Intel ch 08

Download Intel ch 08 docs - Various electronics service manuals

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ch 08

Original Chassis:ch 08
Descr: Intel Legacy Package_databook_1999 ch_08.pdf
Group:Electronics > Other >
Uploaded:2020-03-12 22:42:17
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ch_08.pdfMoisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8 8.1 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the variety of surface mount assembly methods currently in use. Also discussed are the standardized moisture sensitivity levels which control the floor life of moisture/reflow sensitive PSMCs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow related failures. Baking to reduce package moisture level and its potential effect on lead finish solderability is described. In addition, drying, shipping, and storage procedures are included. 8.2 Moisture Sensitivity of PSMCs

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