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Now downloading free:Intel ch 08


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File information:
File name:ch_08.pdf
[preview ch 08]
Size:268 kB
Extension:pdf
MD5:526972f31dbdd2367185bab4704a2ad2
Mfg:Intel
Model:ch 08 🔎
Original:ch 08 🔎
Descr: Intel Legacy Package_databook_1999 ch_08.pdf
Group:Electronics > Other >
Uploaded:12-03-2020
User:Anonymous
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ch_08.pdfMoisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8 8.1 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the variety of surface mount assembly methods currently in use. Also discussed are the standardized moisture sensitivity levels which control the floor life of moisture/reflow sensitive PSMCs along with the handling, packing and shipping requirements necessary to avoid moisture/reflow related failures. Baking to reduce package moisture level and its potential effect on lead finish solderability is described. In addition, drying, shipping, and storage procedures are included. 8.2 Moisture Sensitivity of PSMCs

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