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3.1 Introduction
The packaging technologies used to manufacture or assemble three basic types of component
packages are summarized in this chapter.
The package families, described in Chapter 1, provide the functional specialization and diversity
required by device and product applications. Material and construction attributes of individual
family members are provided by the following package technologies: (1) fired ceramic, (2) pressed
ceramic, and (3) molded plastic. Intel's packaging technology using organic substrates will be
discussed in chapters 13, 14, and 15. Cartridge packaging assembly will be discussed in Chapter
16.
Each of the three package families described in this chapter have some similar process steps but,
the packaging materials and the form factors are uniquely different.
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