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File name:ch_03.pdf
[preview ch 03]
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Original:ch 03 🔎
Descr: Intel Legacy Package_databook_1999 ch_03.pdf
Group:Electronics > Other >
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ch_03.pdfAlumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity required by device and product applications. Material and construction attributes of individual family members are provided by the following package technologies: (1) fired ceramic, (2) pressed ceramic, and (3) molded plastic. Intel's packaging technology using organic substrates will be discussed in chapters 13, 14, and 15. Cartridge packaging assembly will be discussed in Chapter 16. Each of the three package families described in this chapter have some similar process steps but, the packaging materials and the form factors are uniquely different.

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