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ADVANCED MICRO DEVICES INC January 7, 2005 One AMD Place P.O. Box 3453 Sunnyvale, CA 94088-3453 Advanced Change Notification No: 2449 Subject: Change in Packing Method for Certain GeodeTM Products AMD is announcing that the packing method for certain GeodeTM products is changing. See below for details: Product Identification: AMD GeodeTM SC1100, AMD GeodeTM SC1200UCL, AMD GeodeTM GX1, and AMD GeodeTM CS5530 For internal tracking purposes only. Device Version: 1100A3, 1100B1, 1100B1F 1200D2, 1200D3, 1200D32, 1200D33 1201D2, 1201D3, 1201D32, 1201D33 2200D2, 2200D3, 2200D33 3200D2, 3200D3, 3200D33 1000P2, 1000P3 5530B1 Package Types: BGA388 BGD432 BGD352 BGA352 Product Line: PCSG (Personal Connectivity Solutions Group) ACN No. 2449 04/29/05 Description of Change: AMD is changing the packing method & materials at Test subcontractor. See attached file for illustration. The tray cover will no longer be used. It is being replaced with a "bubble bag". Reason for Change: To be consistent with the current AMD packing method used on all other products at other test sites. Application Impact: Different materials to recycle. No change to device or to device specifications. Material shipped after 2/15/05 may be of either packing method, depending on AMD inventory levels. Different packing methods may be used in same shipment. Samples Available Date: January 31, 2005 Production Shipment Date: February 15, 2005 Products Affected By This Change (AMD part numbers): CS5530A-UCE B1 GX1-200B-85-1.8 23 GX1-233B-85-1.8 23 GX1-266B-85-1.8 23 GX1-300B-85-2.0 23 GX1-333B-85-2.2 23 SC1100UFH-233 B1 SC1100UFH-233F B1

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