ST am81720-0 free download

File name am81720-0.pdf

AM81720-012 RF & MICROWAVE TRANSISTORS COMMUNICATIONS APPLICATIONS . . REFRACTORY/GOLD METALLIZATION . . EMITTER SITE BALLASTED RUGGIZED VSWR :1 . . LOW THERMAL RESISTANCE INPUT/OUTPUT MATCHING . . OVERLAY GEOMETRY METAL/CERAMIC HERMETIC PACKAGE POUT = 12 W MIN. WITH 7.4 dB GAIN .400 x .400 2LFL (S036) hermetically sealed ORDER CODE BRANDING AM81720-012 81720-12 PIN CONNECTION DESCRIPTION The AM81720-012 is designed specifically for Tele- communications applications. The device is capable of withstanding any mis- match load condition at any phase angle (VSWR :1) under full rated conditions. The unit is an overlay, emitter site ballasted, geometry utilizing a refractory/gold metallization system. The unique AMPACTM devices are housed in Her- 1. Collector 3. Emitter metic Metal/Ceramic packages with internal 2. Base 4. Base Input/Output matching structures. ABSOLUTE MAXIMUM RATINGS (T case = 25