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Now downloading free:Agilent 5091-9074E Beam Lead Attachment Methods - Application Note c20131025 [8]


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5091-9074E Beam Lead Attachment Methods - Application Note c20131025 [8].pdfAgilent Beam Lead Attachment Methods Application Note Figure 1. General setup for attaching beam lead devices Introduction This application note gives the first time user a general description of various attach- ment methods for beam lead devices. The attached table summarizes the salient features of all the methods including the advantages, disadvantages, and the associ- ated cost of the equipment. Equipment selection as dictated by the type of substrate being used is emphasized. Attachment Methods Beam lead devices can be attached by any of the conventional means, but matching the method to the intended substrate, conductor metals and finish is imperative to a reliable, cost effective process. The various methods should be evaluated in light of this requirement. A general setup for attaching beam leads is shown in Figure 1. Characteristics of the various methods are discussed below. Thermocompression bonding

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