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gxebgapkg_issue.pdfAMD GeodeTM Solutions EBGA Package Clarification 1.0 Scope Some AMD GeodeTM devices are available in an EBGA As a result of the cavity size tolerance in addition to the (Enhanced Ball Grid Array) package. This document pro- assembly process controls, it is possible for the die attach vides clarification on the EBGA package. The data book(s) epoxy to bridge the die edge and heat sink to the sidewall, do not specify any electrical condition pertaining to the and short the die backside and heat sink to VSS. The vol- metal top. Through the epoxy die attach process used for ume resistivity of the die attach epoxy is ~ 0.3 -cm. the Geode devices, the metal top (heat sink) of the EBGA In summary, the epoxy bridging is inherent to the manufac- package can be electrically open or connected to VSS. turing process. Some d


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