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|Original Chassis:||ch 16|
|Descr:|| Intel Legacy Package_databook_1999 ch_16.pdf|
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|ch_16.pdf||Cartridge Packaging 16
Intel has introduced a variety of innovative package designs over the years: surface mount, small
out-line, very thin package, multilayer molded plastic quad flatpacks (PQFP), and the Tape Carrier
Package (TCP) format. Recent configurations for optimum microprocessor performance are the
Single Edge Contact (S.E.C.) cartridge and the Mobile Mini-Cartridge.
The S.E.C. cartridge typically combines an area array packaged processor core, L2 cache, other
components, and a thermal solution attach point. The entry of the S.E.C. cartridge technology
continues the commitment to provide packaging solutions which meet Intel's rigorous criteria for
quality and performance.
The mobile mini-cartridge is a packaging technology aimed at the |
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