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40 GHz ON-WAFER MEASUREMENTS WITH THE HP 8510 NETWORK ANALYZER AND CASCADE MICROTECH WAFER PROBES Eric Strid, Reed Gleason, Keith Jones Cascade Microtech, Inc. P.O. Box 2015 Beaverton, Oregon 97075 RF & Microwave Measurement Symposium and Exhibition Flin- HEWLETT ~~ PACKARD Hewlett-Packard is pleased to have the opportunity to present this paper, written by Eric Strid, Reed Gleason, and Keith Jones, of Cascade Microtech, Inc., at the RF & Microwave Measurement Symposium and Exhibition. Abstract: The paper presents a system, consisting of the HP 8510 network analyzer and Cascade Microtech wafer probes, that is used to make RF measurements of microwave devices and ICs (MMICs) directly on-wafer for frequencies up to 40 GHz. The configuration of the system and the characteristics of the wafer probes are described. On-wafer calibration methods including the traditional open, short, load, and the newer thru, reflect, line (TRL) will be covered. Probe techniques for making the best possible on-wafer measurements will also be addressed, and a range of on-wafer measurement applications will be examined. Biography: Reed Gleason (M'68) was born in Portland, OR in 1945. He received the B.S. degree in electronic engineering from the California Institute of Technology, Pasadena, CA, in 1967. He joined the Naval Research Laboratory in 1967 where he worked on GaAs detector and mixer diodes, silicon TRAPATT diodes and GaAs and InP MESFETs. He joined Tektronix in 1978 where he worked on GaAs devices and integrated circuits. In 1983, he co-founded Cascade Microtech, Inc., where he now holds the position of Vice President of Engineering. In this paper, recent developments in wafer probing, including 40 GHz probes and test set for the HP 8510 Vector Network analyzer will be discussed. First, we will describe the OUIUlNllE available equipment and connections for 40 GHz on wafer measurements. The most recent techniques for accurate 1. Introduction calibration and verification of the system will then be presented. Techniques for care and cleaning of the probe tips 2. New equipment for 40 GHz on for maximum mechanical lifetime will be discussed and, wafer measurements [mally, some measurement examples will b

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