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Agilent Correlation of Simulation versus Measurement in Frequency and Time Domain White Paper Contents Overview ... 2 Measurement Equipment ... 3 TDR Measurements ... 3 Frequency Domain Correlation Results ... 5 Comparison with Agilent TRL Calibration ... 10 Measured Time Domain Results at 3.125 Gbps... 12 Number of Bits Sampled by the Oscilloscope ... 14 Simulated Time Domain Results at 3.125 Gbps ... 15 Conclusions ... 16 Agilent Physical Layer Test System Configuration Guide... 18 Web Resources ... 19 Acknowledgment ... 19 Overview A measurement/simulation correlation effort was launched between Agilent Technologies and Cadence Design Systems to validate the new technology developed in the new Cadence Allegro PCB SI 630 product, which was used to produce all simulated data in this paper. The test vehicle consisted of a production Advanced Telecomm Computing Architecture (ATCA) backplane from Kaparel Corporation (a mutual Agilent/Cadence customer), and adaptor cards developed by Agilent, which plug into the backplane and provide surface mount SMA test access. The backplane has 18 layers with a nominal thickness of 125 mils, and uses the Z-PACK HM-Zd 4-pair connector from Tyco Electronics. A picture of the test configuration is shown in Figure 1. A stripline path of approximately 19" through the backplane was studied to correlate simulation vs. measured results in the frequency and time domain. Agilent adapter card Kaparel backplane Tyco HM-Zd connector Figure 1. Test configuration 2 Measurement Equipment All measurements were taken by Agilent Technologies. The Agilent equipment used was the following:

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